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FLY-801 TO Laser Diode Wire bonder
Features
- Thermosonic high speed bonding, fast conversion
- Vision system: Programmable look ahead PR
- Multiple die and level bonding capability
- Rotating platform
- Bonding on crossed planes at any angle
Wire type
Au
Applied Range
Optical communications
Item | Parameter |
Bonding Technology | Thermosonic bonding |
Optics | Single path or double paths (optional) |
Bonding Accuracy | ±3.0μm |
Bonding area | 56 x 70mm |
Cycle time | Parallel planes: 60ms/wire Crossed planes: 80ms/wire |
Wire diameter | 17μm-50μm |
Service Hotline
400-889-8833
粵公網安備 44070302000690號